-
Resonac Asia Pacific Annual Dinner & Dance 2023
01 November 2023On October 6th, 2023, Resonac Asia Pacific (REAP) and Resonac Specialty Gas Singapore (RSGS) came together to host their Annual Dinner and Dance (D&D) event, serving as a beacon of unity and appreciation in the face of a challenging economic climate. The “Journey Around the World” theme, chosen during this difficult period, symbolized the determination […]
-
Resonac hold free webinar “Material Solutions for Next Generation Power Module” on 26th October
02 October 2023Resonac hold free webinar session “Material Solutions for Next Generation Power Module”on 26 th October 2023, twice in same day for EU, US and Asia. Please join us for an enlightening session covering advanced materials in Power Module tech! Please register from here: https://solution.resonac.com/entry-Oct2023-WebinarForPowerModule?lsrc=Website&cid=REAP Webinar Topic and presenter: Date: October 26, 2023Time: [1] 7:00-8:30am(GMT), 9:00-10:30am(CEST), […]
-
Resonac’s Oita Complex Acquires ISCC PLUS certification
03 August 2023—Resonac takes a step toward carbon neutrality by introducing biomass material into its ethylene plant— Resonac Corporation (President: Hidehito Takahashi) announces that its Oita Complex (Oita City, Oita Prefecture) has acquired ISCC PLUS certification, one of the international certification systems for sustainable products. This acquisition of ISCC PLUS certification enables Resonac to allocate properties of […]
-
Resonac Automates Material Inspection by Utilizing Deep Learning-Based Image Analysis
12 July 2023By utilizing deep learning*1 and image analysis— technologies which have been making remarkable progress in recent years—for material inspection, Resonac Corporation (President: Hidehito Takahashi) has succeeded in automating product development and inspection, and in significantly reducing the time required for inspection. For example, the inspection time for solder particles used in anisotropic conductive film can […]
-
Resonac Decides to Acquire 100% Shares in AMI Automation
12 June 2023— Having 200 DX engineers, AMI will help accelerate DX across the entire Resonac Group — Resonac Corporation (President: Hidehito Takahashi; hereinafter, “Resonac”) hereby announces that it has decided to acquire 100% of outstanding shares in AMI Automation (based in Mexico, hereinafter, “AMI”). AMI provides automation, control, and optimization solutions to a diverse range of […]
-
Becoming the First in Japan to Acquire International Certification for a Supply Chain That Adopts Materials Derived from Used Plastics
18 May 2023Resonac Corporation (Tokyo: 4004) (President: Hidehito Takahashi; hereinafter, “the Company”) has acquired ISCC PLUS certification for the three products (hydrogen, ammonia and acrylonitrile) manufactured at its Kawasaki Plant in Kawasaki City, Kanagawa Prefecture. ISCC PLUS is an international certification system for sustainable products. The three products are all manufactured in the Company’s plastic chemical recycling […]
-
TOYOTA Adopts Resonac’s Foamed Moldings for Use as Exterior Parts of “LEXUS RZ”
26 April 2023— Resonac’s original technology reduces weight of parts by more than 30% — Foamed Moldings for exterior parts manufactured with original technology developed by Resonac Corporation*1 (President: Hidehito Takahashi) have been adopted by TOYOTA MOTOR CORPORATION for use as exterior parts of “LEXUS RZ,” which is the first battery electric vehicle (BEV) of TOYOTA’s luxurious car […]
-
Resonac Gives Presentation on Its Effort to Strengthen Supply Chain at Japan-Malaysia Public Private Industrial Policy Dialogue
06 April 2023On April 3, 2023, Resonac Corporation (Tokyo: 4004) (President: Hidehito Takahashi) took part in “Japan-Malaysia Public Private Industrial Policy Dialogue” held in Kuala Lumpur, Malaysia, and gave a presentation on its effort to strengthen supply chain for semiconductor materials. The first Japan-Malaysia Dialogue was hosted by the Ministry of Economy, Trade and Industry of Japan […]
-
Resonac Increases Production Capacity for Adhesive Film for Semiconductor Packaging by 60%
04 April 2023— Resonac Increases Production Capacity for Adhesive Film for Semiconductor Packaging by 60% — Resonac Corporation (TOKYO: 4004) (President: Hidehito Takahashi) will increase its capacity to produce “Dicing Die Bonding Film,” which is a two-in-one adhesive film with the functions for both dicing tape and die bonding film used in semiconductor packaging process (backend process), […]
-
DENSO Adopts Resonac’s SiC Epi-wafer for Power Semiconductor for Use in Inverter
31 March 2023— The new inverter will be installed in Toyota’s new BEV “LEXUS RZ” — DENSO CORPORATION has decided to adopt silicon carbide epitaxial wafer for power semiconductor (SiC epi-wafer) manufactured by Resonac Corporation (Tokyo: 4004) (President: Hidehito Takahashi) with the aim of using it as material for driver element of DENSO’s new inverter. This inverter […]
