Map Molding Support Tape (RT Tape)



RT series is a supporting tape used in the map molding process of QFN and SON. Attaching on the reverse face of a lead frame, it has achieved no flush burr after molding and high productivity in wire bonding. The applications has been expanded to new packages besides QFN and SON.


  • Thermoplastic resin with high thermal stability for adhesive layer.
  • Good wire bondability.
  • No flash burr after molding.
  • No Adhesive on a lead frame after detaping.
  • Low adhesiveness of the tape at room temperature achieves no dust attachment.

Characteristics (Typical Values) & Line-Up

※Heating is required for some lead frames and epoxy molding compounds.

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