By utilizing deep learning*1 and image analysis— technologies which have been making remarkable progress in recent years—for material inspection, Resonac Corporation (President: Hidehito Takahashi) has succeeded in automating product development and inspection, and in significantly reducing the time required for inspection.  For example, the inspection time for solder particles used in anisotropic conductive film can […]

— For Contribution to the Electrification of Vehicles and Others through Co-Creation with External Parties — Resonac Corporation (TOKYO: 4004) (President: Hidehito Takahashi) is set to launch full-scale operation of Power Module Integration Center (“PMiC”), which is located at Oyama Plant in Tochigi Prefecture, to enhance development activity of materials for power semiconductor and its […]

— With Computational Science and Materials Analysis Professionals Also Stationed at the Same Resonac R&D Center — In January 2023, Resonac Corporation (TOKYO: 4004) (President and CEO: Hidehito Takahashi) is launching a project to develop new semiconductor materials for 6G, the next-generation telecommunication system standard following 5G. Resonac will implement this development project, which starts […]

— Enables engineers to experience “molecular level visualization,” and makes a significant contribution to accelerating development and discovery of new materials — Resonac Corporation (TOKYO: 4004) (President: Hidehito Takahashi) has successfully applied virtual reality (VR) technology*1 to the development of semiconductor materials. This is the first time that the VR technology has been implemented to […]