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Resonac Starts Development of New Semiconductor Materials for 6G at the Newly Opened Innovation Base

13 March 2023

— With Computational Science and Materials Analysis Professionals Also Stationed at the Same Resonac R&D Center —

In January 2023, Resonac Corporation (TOKYO: 4004) (President and CEO: Hidehito Takahashi) is launching a project to develop new semiconductor materials for 6G, the next-generation telecommunication system standard following 5G. Resonac will implement this development project, which starts with the molecular design stage, in cooperation with ventures and universities at its “Stage for Co-creation” R&D center newly opened in Yokohama City, where teams of experts, including those in computational science and materials analysis, have been stationed since the end of December. Companies around the world are competing for the development of 6G systems, which are expected to be put into practical use in around 2030. Resonac aims to develop materials that will support high-frequency data transmission in the terahertz band.

With 6G set to be 100 times faster than 5G, new semiconductor materials are needed to substantially reduce the transmission loss associated with the increased communication speed. To meet this requirement, Resonac will develop materials and technologies for composite materials from scratch, starting with the synthesis of materials to create resins and ceramics for filler materials, as well as developing interface control technologies. In order to identify the optimal combination of materials to provide the required characteristics, Resonac will perform simulations and use AI systems in the molecular design stage to swiftly derive the required chemical structural formulas, a feat that would be impossible using conventional methods. Also, while it would take three months to manually test one combination of materials, the use of AI and other systems will make it possible to test one combination per day, or as many as 90 different combinations in three months.

Such development activities will be supported by a group of professionals with expertise in fundamental technologies for R&D. As a base for open innovation and Resonac’s R&D center, the “Stage for Co-creation” concentrates experts in computational science, materials analysis, manufacturing process technology & equipment management for mass production, and the management & evaluation of chemical safety. For example, the “Research Center for Computational Science and Informatics” has 70 specialists in simulation, AI and MI. These specialists have engaged in the process of developing catalysts from the molecular design stage in the petrochemicals and basic chemicals fields. Many of them are shifting their focus to the development of semiconductor materials to support the development project. Moreover, experts on mass production technology will also make contributions in the production process examination stage.

At the “Stage for Co-creation”, the solution of social issues on a medium-to long-term basis will be pursued as the driving R&D theme. The first initiatives to be implemented under this theme include plastic chemical recycling as well as the development of semiconductor materials for 6G. Toward the achievement of carbon neutrality by 2050, research is being carried out in order to identify a method to recover raw materials for plastics such as ethylene directly from waste plastics. For this, research personnel need not only to overcome technological challenges but also to listen to advice and opinions from those who contribute to the sorted collection of waste plastics and use recycled products. In this and other projects, personnel at the “Stage for Co-creation” will work toward the solution of social issues by promoting dialogue and co-creation with a wide range of stakeholders, including local governments and consumers. 

 Stage for Co-creation (Yokohama City)
Stage for Co-creation (Yokohama City)

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RESONAC (Semiconductor Materials Manufacturer in Japan) to Use Virtual Reality Technology for Product Development

09 March 2023

— Enables engineers to experience “molecular level visualization,” and makes a significant contribution to accelerating development and discovery of new materials —

Resonac Corporation (TOKYO: 4004) (President: Hidehito Takahashi) has successfully applied virtual reality (VR) technology*1 to the development of semiconductor materials. This is the first time that the VR technology has been implemented to develop semiconductor materials in Japan*2.

Molecular dynamics (MD) simulation*3 is a powerful tool for R&D of semiconductor materials at the atomic scale. We employ MD simulations to study interactions at the interface between different materials, such as the adsorption and adhesion of organic molecules on an inorganic substrate with thousands of atoms. However, their behaviors are hard to observe on a simple computer screen. As a result, even experts in computational science often perform only a statistical analysis. The analysis is not easy for non-experts to understand.

Six months ago, we began exploring VR technology with head-mounted display*4 for analyzing the behavior of molecules at interfaces in three-dimensions. The technology visualizes “the atomic and molecular world” of 0.1 nm, one ten-billionth of a meter, in front of our eyes, allowing us to place ourselves at the same scale. We can observe the molecular behavior at the substrate-molecule interface while intuitively handling “molecules”.

We also found that the VR technology is helpful for non-experts to understand the behaviors, such as how atoms in a substrate bond with molecular chains of organic molecules. The VR technology, thus, facilitates communication between computational science and materials development experts, accelerating our R&D activities.

Our first application of VR technology is in “analyzing the mechanisms of interaction between an inorganic substrate and organic molecules” for semiconductor and electronic materials, such as CMP slurries (polishing materials)*5.

Comparison of 2D and 3D
Comparison of a conventional image represented in two-dimensions, and an image visualized using VR represented in three-dimensions

Note: These are examples based on MD simulations of inosinic acid (C10H13N4O8P) on a silica (SiO2) substrate, and are not actual examples in the fields of semiconductor and electronic materials.
Note: The image where VR is used is a two-dimensional representation of material originally represented in three-dimensions. When viewed on a head-mounted display, viewers can clearly experience positional relationships in a more spatial way. 
View a video of VR in use here: https://youtu.be/7E5YjA7xxf0

 An engineer using VR with a head-mounted display
An engineer using VR with a head-mounted display

Dr. Yoshishige Okuno, Head of Research Center for Computational Science and Informatics, Resonac Corporation, said “VR technology greatly supports our R&D based on computational molecular-design. It leverages our advanced computational science technology to help more in-depth analysis and discovery of new materials. We would like to firstly extend the VR throughout the company, and to secondly elevate it to an internal infrastructure. We will fully utilize computational science and simulations to accelerate our research and development.”


*1  VR technology: VR stands for Virtual Reality, a technology that allows users to experience computer-generated digital spaces as if they were real.
*2  Based on Resonac’s survey. 
*3  Molecular dynamics simulations: A method of calculation for analyzing the behavior of molecules by focusing on the motion of atoms and solving equations of motion that take into account the interactions between atoms. It is also referred to as molecular simulation.
*4  Head-mounted display: A display device worn on the head that uses the parallax between the left and right eyes to display virtual reality in three-dimensions.
*5  CMP slurry: CMP (Chemical Mechanical Planarization) slurry is a material consisting of abrasive grains and liquid for polishing and planarizing unevenness generated in the circuit formation process of semiconductor devices.

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Resonac Develops and Starts to Mass-produce Third Generation High-grade SiC Epitaxial Wafers

01 March 2023

— Through supply of top-quality epitaxial wafers, Resonac contributes to practical application of space-saving high-output next-generation power semiconductors —

Resonac Corporation (Tokyo: 4004, President: Hidehito Takahashi) has developed a third generation of high-grade silicon carbide (SiC) epitaxial wafer (HGE-3G) for power semiconductors and has started to mass-produce it.  HGE-3G has quality superior to that of second-generation high-grade SiC epi-wafer (HGE-2G), which has been mass-produced up to the present. 

SiC power semiconductor reduces power loss which occurs in conversion of electricity and emits less heat than conventional silicon-wafer-based power semiconductor, thereby conserving energy.  Therefore, the demand for SiC power semiconductor is increasing rapidly especially in the field of industrial use, including use in electric vehicles (EVs) and renewable-energy-based power generation.  SiC epi-wafer is produced through deposition and growth of epitaxial SiC layer on the surface of single crystal SiC substrate, and it is used as main material for SiC power semiconductors.  Resonac has been supplying world-class-quality SiC epi-wafers as the largest independent supplier in the world and is acclaimed by many device manufacturers inside and outside Japan.

High-end models of power semiconductors for use in high-priced EVs and railcars are required to conduct electric current of higher density to achieve high output and space saving concurrently.  To realize conduction of high-density electric current, SiC-epi-wafer manufacturers must develop technology to prevent expansion of dislocation defects existing in SiC substrate into epitaxial SiC layer.  This time, Resonac has developed the very latest technology to grow epitaxial SiC layer and successfully solved the abovementioned problem and started to mass-produce third-generation high-grade SiC epi-wafers.  This HGE-3G has high-reliability under high electric current density, and it will contribute to the spread of SiC-based high-end power modules.

The Resonac Group aims to be a “Co-Creative Chemical Company” and contribute to the sustainable development of global society.  Under this vision, Resonac positions its operation to produce SiC epitaxial wafers, which contributes to efficient use of energy, as a next-generation business, and will allocate much of our business resources.  In September 2022, Resonac started to ship samples of 200mm SiC epi-wafers using in-house manufactured single crystal SiC wafers.*1  In addition, Resonac has been promoting “The Project to Develop SiC Wafers Technology for Next-generation Green Power Semiconductors,”*2 which aims to improve quality of SiC epi-wafer further.  The Resonac Group will continue contributing to the spread of SiC power semiconductors by maintaining “Best in Class” as its motto and continuing provision of high-performance and highly reliable products.

*1. For detail, please refer to the news release, “Showa Denko Starts to Ship Samples of 200mm SiC Epi-wafers,” which was announced on September 7, 2022.
*2. For detail, please refer to the news release, “Showa Denko’s Program to Develop 8-inch SiC Wafers for Next-generation Green Power Semiconductor Selected for NEDO’s Green Innovation Fund Projects,” which was announced on May 23, 2022.

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Announcement of Paperless Product Operation Manuals and Certificate of Analysis and Product Package Renewal

31 January 2023

As a part of our environmental contribution, Shodex will shift to provide digital versions of operation manuals and certificate of analysis (CoA) instead of enclosing their printed versions in the products. We will start the action with some products and sequentially shifting into the digital versions, aiming in all Shodex products. This process begins in January 2023.

Digital versions are ready for those products provided without enclosed printed versions. Please make sure to download them before use. Please check the URL and 2D barcode for download on the package of the target product.

Furthermore, we will start using renewed packages. You may find the operation manual and CoA download website address written on the package. This new package is constructed only from cardboard papers.

We appreciate your understanding and cooperation with Shodex‘s environmental efforts.

Shodex New Packaging Design

Source: www.shodex.com

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Resonac Asia Pacific – Functional Chemicals Products: Vinyl Ester Resin, Emulsion

31 January 2023

Resonac successfully developed Epoxy Vinyl Ester resin in the early 1960s based on its independent technology. We are the first company to produce Vinyl Ester resin on a commercial scale and the No.1 Vinyl ester resin supplier in Japan.

Resonac Asia Pacific (formerly Showa Highpolymer Singapore Pte Ltd) started to operate the Sales & Marketing in ASEAN as a branch company of Functional Chemicals Department of Resonac in Singapore since 2008. We support an extensive area, covering ASEAN, India, Middle East, Oceania and Taiwan.

Besides Vinyl Ester Resin (RIPOXY™) and Unsaturated Polyester Resin (RIGOLAC™) for FRP and FC lining application, we also handle Emulsion (POLYSOL™) which is a Water Based Synthetic Resin for Building Material Painting, Adhesive (PSA) and EVA and HPLC Column (High Performance Liquid Chromatography, SHODEX™) for Pharmaceutical, Food, Chemicals, Water, etc.

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Resonac and Infineon Technologies Strengthen Cooperation in SiC Materials for Power Semiconductors

12 January 2023

Resonac Corporation (Resonac) (President: Hidehito Takahashi) has concluded new multiyear contracts with Infineon Technologies AG (Infineon), a German semiconductor manufacturer providing power semiconductors worldwide, to continue supplying SiC materials for power semiconductors to Infineon and cooperatively developing technologies related to SiC materials.  Resonac concluded these new contracts in order to complement and expand the preceding supply and joint development contracts concluded in 2021*1, thereby strengthening the partnership with Infineon.

Resonac expects this partnership will enable Infineon to apply Resonac’s SiC materials to various power semiconductor products, and now Resonac plans to provide Infineon with SiC materials of 200mm (8-inch) diameter, in addition to those of 150mm (6-inch) diameter.  Furthermore, Resonac will accelerate improvement in technologies for and product quality of SiC epitaxial wafers through reinforced joint development activities with Infineon.  Resonac and Infineon are confident that the strengthened partnership of the two companies will support rapid growth of the market for SiC materials, which are next-generation materials for semiconductors, and contribute to stabilization of the supply chain of SiC-based power semiconductors.

The Resonac Group aims to contribute to sustainable development of global society as a “Co-creative chemical company,” and the Group positions its SiC epitaxial wafer business as a next-generation business because SiC-based power semiconductor realizes efficient use of energy.  Under a motto of “Best in Class,” the Resonac Group will continue providing the market with high-performance and highly-reliable SiC products, thereby contributing to the proliferation of SiC power semiconductors.

*1: “Showa Denko and Infineon Technologies Conclude Supply Contract and Development Agreement” announced on May 6, 2021
 

For reference, we attach Infineon’s press release as follows.
 

Infineon and Resonac announce the expansion of their cooperation and a new multi-year agreement for delivery of silicon carbide (SiC) materials

Munich, Germany – 12 January 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is extending its cooperation with silicon carbide (SiC) suppliers. The German-based semiconductor manufacturer has signed a new multi-year-supply and cooperation agreement with Resonac Corporation (formerly Showa Denko K.K.), complementing and expanding the announcement of 2021. The new set of contracts will deepen the long-term partnership on SiC material. According to the agreement, Resonac will supply Infineon with SiC materials for the production of SiC semiconductors, covering a double-digit share of the forecasted demand for the next decade. While the initial phase focuses on 6″ SiC material supply, Resonac will also support Infineon’s transition to 8″ wafer-diameter during the later years of the agreement. As part of the cooperation, Infineon will provide Resonac with intellectual property relating to SiC material technologies. The Infineon – Resonac partnership contributes to supply chain stability and will support the rapid growth of the emerging semiconductor material SiC.

”The demand for SiC is growing rapidly and we are preparing for this development with a significant expansion of our manufacturing capacities,” said Angelique van der Burg, Chief Procurement Officer at Infineon. “We are pleased to deepen our collaboration with Resonac and strengthen the partnership between our two companies.”

“The business opportunities in the area of renewable energy generation and storage, electromobility and infrastructure are enormous for the years to come. Infineon is doubling down on its investments into SiC technology and product portfolio, to proliferate the most comprehensive product offering to its customers. We are very happy that our partnership with Resonac will strongly support our market-leading position,” said Peter Wawer, President of Infineon’s Industrial Power Control division.

“We are pleased to team-up with Infineon as a global leader in power semiconductors in order to meet the growing demand for SiC in the years to come. We will continuously improve our Best-in-Class SiC material and develop the next generation of 8″ wafer technology. We value Infineon as an excellent partner in this regard,” said Jiro Ishikawa, Executive Adviser of Device Solutions Business Unit at Resonac.

Infineon is currently expanding its SiC manufacturing capacity in order to reach a market share of 30 percent by the end of the decade. Infineon’s SiC manufacturing capacity is about to increase tenfold by 2027. A new plant in Kulim is scheduled to start production in 2024. Today, Infineon already provides SiC semiconductors to more than 3,600 customers worldwide.

About Infineon
Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 56,200 employees worldwide and generated revenue of about €14.2 billion in the 2022 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).
Further information is available at www.infineon.com
This press release is available online at www.infineon.com/press
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Resonac Aims to be a Leading Functional Chemical Manufacturer by Raising Reformers

04 January 2023

-CEO Takahashi Gives New Year Address following the Launch of Resonac-

On January 1, 2023, Showa Denko K.K. (SDK) and Showa Denko Materials Co., Ltd. (SDMC, former Hitachi Chemical Company, Ltd.) merged and transformed themselves into two new companies, namely a holding company named “Resonac Holdings Corporation,” and a manufacturing company named “Resonac Corporation” (hereinafter collectively called “Resonac”). Hidehito Takahashi continues leading both companies as President and CEO. The Resonac Group has defined its purpose as “Change society through the power of chemistry,” aiming to become a leading functional chemical manufacturer in the world. The Group will reform its business portfolio and start to tackle the new challenges. Hidehito Takahashi, President and CEO of Resonac, made a new year address to declare the launch of the new Resonac Group. “The birth of Resonac is its second foundation. We will reform the Group by raising talent who can take positive actions autonomously and creatively,” he told the whole staff of the Group.

Hidehito Takahashi, President & CEO
Resonac Holdings Corporation

Resonac, a global top semiconductor/electronic materials manufacturer


Resonac’s annual sales of semiconductor and electronic materials amount to about 400 billion yen, while the Group’s annual net sales amount to about 1.4 trillion yen. Resonac is the global top manufacturer of semiconductor materials having overwhelming share of the market for materials used in downstream of semiconductor production process, which has been attracting people’s attention.

As a result of the integration of former SDK and former SDMC, we now have a combination of former SDK’s stable-earnings businesses including petrochemicals, graphite electrodes, and basic chemicals businesses, and former SDMC’s semiconductor and electronic materials business, which is a growth driver. Following the announcement of the decision to integrate former SDK, which has strength in production of midstream materials, and former SDMC, which has strength in production of downstream materials, the two companies started to work collaboratively, and produced excellent results in R&D and production processes of various products including CMP slurries and copper-clad laminates.

To contribute to sustainable development of society through solution of technical problems as a chemical company, it is very important for Resonac to promote collaboration and cooperation with other companies and other industries.  The Resonac Group aims to be a “Co-creative Chemical Company” that creates value through co-creation.

Outline of CEO Takahashi’s new year address


Newly launched Resonac aims to be a leading functional chemical manufacturer in the world.  To this end, the most important thing for Resonac is to cultivate corporate culture that brings on autonomous and creative people.

I want to reform Resonac to be a company about which other companies’ people say “We want to employ people like those working at Resonac.”  I aim to accomplish this reform because bringing on talent who can execute strategy will be a decisive factor that gives competitiveness to a company. 

Last year, to spread Resonac’s Purpose and Values among the staff of the Group, the management including me visited the Group’s business bases, and exchanged views with the staff face-to-face.  This year, we will have workshops in which we will discuss problems and find actions to solve them together, execute personnel evaluation system based on Values, have programs to share practice cases of Values beyond boundaries between organizations, and commend practice cases of Values. 

Social circumstances including the situation in Ukraine and confrontation between the United States and China are expected to be tense in medium to long term.  To cope with such social circumstances, it is very important for Resonac to practice not only “human resource development” which I mentioned before, but also “sustainability,” “DX” (digital transformation), and “marketing.”  The entire staff of Resonac must work to put these four important measures into practice.

Practice of sustainability is a necessary condition for Resonac to become a leading functional chemical manufacturer in the world.  To achieve the Group’s sustainable growth, Resonac must contribute to avoidance of global environmental crisis.  Resonac will update its activities to achieve carbon neutrality, introduce the viewpoint of sustainability into the Group’s business portfolio management and development of new businesses and technologies, thereby strengthening its relationship with stakeholders.

To win through in the global competition, Resonac must promote DX.  In the processes of product development and manufacturing, artificial intelligence (AI) and materials informatics (MI) are replacing human experience and intuition.  Improvement in customer relations and sales promotion also requires DX.  This year, Resonac will develop human resources for DX, aiming to lay the solid foundation of DX and make a leap forward in the Group’s performance.

To survive the age of volatility, uncertainty, complexity, and ambiguity (VUCA), it is necessary for Resonac to remove the barriers between organizations, grasp customers’ needs, and develop required materials.  We will strengthen cooperation between R&D section and marketing section, push ahead fusion of “Chemistry to synthesize” and “Chemistry to formulate” further, and promote co-creation inside and outside the company.

Co-creation requires each member of Resonac to work autonomously and cross-sectionally as a professional.  Each member of Resonac is the true leader who change society and drive this company.

The birth of Resonac is the second foundation of the company.  This is not our goal, but rather, this is our start.  Everybody in the Resonac Group!  Let’s go forward together!

[Reference]


New company names
1.    New company names
The new corporate group has a holding company structure.  Names of holding company and manufacturing company are as follows.

Holding company
Resonac Holdings Corporation

Manufacturing company
Resonac Corporation

2.    Our hope put into the new trade name and corporate logotype

The Newly Integrated Company Resonac defines its purpose as “Change society through the power of chemistry.”  To achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners.  As a “Co-creative Chemical Company,” Resonac will aim at ensuring sustainable growth and enhancing enterprise value through such co-creative efforts.

The name “Resonac” was created as a combination of the word “Resonate” and “C” as the first letter of “Chemistry.”  We put into this name our hope that the Group’s wide-ranging and flexible advanced material technologies will be connected and resonate with our partners’ various technologies and ideas to realize bright future, and the resonance will spread further to meet new partners, thereby creating a powerful surge that changes society.

Source: www.resonac.com

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Vinyl Ester Applications: Past Projects

23 December 2022

Resonac vinyl ester products are loved by customers around the globe and you can view the past projects for your reference.

Thermal power plant project in Vietnam
・Year: 2015
・Application: FRP Stack
・Dimension: D 5,000mm x 200m
・Resin: Ripoxy H-630EX, Rigolac 150HRN-EX
Sea Water Manifold & Header in India
・Year: 2015
・Application: FRP Stack
・Dimension: D.5000mm x 200m
・Resin: Ripoxy H-630EX, Rigolac 150HRN-EX
Sea Water Manifold & Header in Dalian
・Year: 2013
・Application: FRP Pipe
・Dimension: Dia 80-240, L 3,200-5,318 mm
・Resin: Ripoxy R-802EX
Thermal power plant project in Vietnam
・Year: 2012
・Project: FRP Stack
・Dimension: 5,000 mm x H 188,550 mm; Qty 2 units
・Resin: Ripoxy H-630EX, Rigolac 150HRN-EX
Thermal power plant project in Vietnam
・Year: 2011
・Project: FRP Stack
・Dimension: 5,000 mm x H 200,000 mm; Qty 2 units
 ・Resin: Ripoxy H-630EX, Rigolac 150HRN-EX
Resort World Sentosa Project in Singapore
S.E.A. Aquarium
・Year: 2011
・Application: Water proof lining
・Dimension: 28,000m2 
Panoramic view, water corridor
・Resin: Ripoxy R-802EX
Algeria Oman Fertilizer in Algeria
・Year: 2010
・Product: Hypochlorite Storage Tank / Acid Cleaning Tank
・Dimension: 3,800 x H 10,000 mm (1 unit) / 1,600 x H 2,500 mm (1 unit)
・Resin: Ripoxy R-802EX
Cold & Sea Water Header in Mexico
・Year: 2010
・Product: FRP Pipes
・Dimension: 80 – 200 x L 3,200 – 5,318 mm
・Resin: Ripoxy R-802EX
Mist Contrail & Insulator Casing in Thailand
・Year: 2010
・Product: FRP Mist Contrail & Insulator Casing
・Dimension:
 L 3,050 x W 2,700 x H 2,100 mm (2 units) 
 L 1,700 x W 800 x H1,450 mm (4 unit)
・Resin: Ripoxy R-802EX

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Amalgamation and Name Change

19 December 2022

Please be informed that, pursuant to Section 215A and Section 215D of the Companies Ac 1967 of Singapore (the “Companies Act“), Showa Denko Singapore (Pte) Ltd. (“SSPL“), Showa Denko Materials (Asia-Pacific) Pte. Ltd. (“SDMAP“), and Showa Highpolymer Singapore Pte. Ltd., intend to undertake an amalgamation, whereby SDMAP will continue as the amalgamated company, and the name of the amalgamated company will be changed to “Resonac Asia Pacific Pte. Ltd.” (the “Amalgamated Company“) (the “Amalgamation“).

The Amalgamation is intended to take effect on 1 February 2023 (or such other date as we may notify our customers in writing) (“Effective Date“).

Pursuant to Section 215G of the Companies Act, all the property, rights, privileges, liabilities and obligations of SSPL will be transferred to the Amalgamated Company on the Effective Date.
Accordingly, all the rights and obligations of SSPL under the Contract will, by operation of law, be automatically transferred from SSPL to the Amalgamated Company on the Effective Date, and the Amalgamated Company will take place of SSPL under the Contract. For the avoidance of doubt, such transfer does not change any of the terms and conditions of the Contract.

With effect from the Effective Date, all correspondences and invoices intended for SSPL should be addressed to the Amalgamated Company:

Resonac Asia Pacific Pte. Ltd. (formerly Showa Denko Materials (Asia-Pacific) Pte. Ltd.)
4 Shenton Way, #16-02/06 SGX Centre 2, Singapore 068807
GST Rec. No.: 20-0403873-Z

If you have any questions, please do not hesitate to contact us.

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How aerosol spray works and what’s inside?

26 October 2022

During this time, we have received many inquiries from the aerosol industry. Unfortunately, it seems the price hike and supply shortage is going on for Molecular Sieve. However, you might be wondering what Molecular Sieve is and why the aerosol industry needs it. It is actually in our daily life, but we might not have noticed it before. Please let us walk you through the article about Molecular Sieve for the aerosol industry.

What is aerosol?

Firstly, the aerosol industry might sound too technical and give you a complicated feeling. To make it simple, dust or fog is an example of natural aerosols. It is a suspension of fine solid particles or liquid droplets in air or any gas. Mist also one of it.

How is it being used in the aerosol industry?

For industrial, we create synthetic aerosols by making use of the same physics. The suspension of fine particles, liquid or gas. Looking into the aerosol industry (aka spray industry), they make use of it to contain gas or liquid at room temperature. It is simply poured into the can and sealed. The popular propellant is liquefied gas. It is simply poured into the can, pumped at high pressure, and sealed.

Under a high level of pressure, liquid cannot turn into gas. Therefore, when you press the button for spraying, the valve is open, pressure becomes reduced. This liquid propellant will boil and form a gas layer on top. Then, it will push the real liquid product mixing with some of the liquid propellant up the tube to the nozzle. If you ever hear the ball rolling sounds when shaking the spray can, that “pea” helps to mix the liquid product and liquid propellant well together. And, the product will be pushed as a fine mist for us. It is one liquid pushing after another and getting shaped by the nozzle.

Inside a liquefied gas aerosol can

And, why do we need Molecular Sieve for the aerosol industry?

Liquefied gas is being used as liquid propellant that’s also mixing with the product. The gas is LPG (Liquified Petroleum Gas) which comes from natural source, but it shouldn’t be smelly for consumers. So, here is where Molecular Sieve comes.

Molecular Sieve is a desiccant that has very small holes which act as a filter to let only some smaller and equaled molecules go in, and the bigger ones cannot. Mercaptan is a sulfur compound that exists in LPG. I only mentioned sulfur compounds, but I suppose you could imagine that the smell is not very pleasant. Therefore, aerosol makers need to use Molecular Sieve to remove Mercaptan from LPG.

The general name of Molecular Sieve would be 3A, 4A, 5A and 13X. Molecular Sieve 13X is the most popular to be used in the aerosol industry to absorb Mercaptan smell for a nice deodorant, perfumes and other products.

Benefits of our Molecular Sieve

  • High crush strength, high quality for pressurized condition
  • Stable Supply: own factory, provide timely shipment.
  • Good price: we strive our best to lower your cost.

Please feel free to contact us if you are looking for any details of Molecular Sieve, or if you have any questions.
Thank you for dropping by to our website.

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