Overview
Resonac’s resist materials for forming printed wiring board circuits are applicable to direct-writing exposure machines that pattern circuits using laser beams.
Features
- Provides excellent shaped resist profiles, and is capable of forming fine-pitch circuits based on film thickness.
- Responds to circuit formation by semi-additive processing.
- Applicable to direct-writing exposure machines.
Film Characteristics & Line-Up
※DE-1 UH was applied(Adtec Engineering Co.,Ltd, 405 nmDI)
Substrate roughness Ra:0.4 µm
Post exposure bake (P.E.B) : 80 degree C, 30 Sec. (Box Oven)
Developer : 1.0 wt% Na2CO3aq., 30 degree C, 0.16 MPa
Resist Profile
