Resonac’s photosensitive materials designed to form thick resist pattern layers are used for such applications as the copper plating process of printed wiring boards requiring a high aspect ratio and electroforming in metal mask manufacturing.

• Superior resolution/adhesion and is capable of forming resists with a thickness more than double the hole diameter and line width.
• Offers a thick film lineup (35-168 um) in response to various applications.
• Superior chemical resistance, and applicable as a resist for copper plating and electroplating.
• Responds to development with standard sodium carbonate solutions and peeling solutions used for printed wiring boards.
• Provides smooth sidewall shapes.

※1Collimated light type

Resist Profile