Resonac’s adhesive tapes are designed to prevent the leakage of resins attached to the backside of lead frames when map molding quad flat non-leaded (QFN) packages. Attaching on the reverse face of a lead frame, it has achieved no flush burr after molding and high productivity in wire bonding.

• Superior wire bonding properties (including Cu wires) due to high Tg, high thermal stability, and low outgassing.
• Superior performance in preventing resin leakage (burrs, mold flashes) during the molding process.
• Low adhesive residue when peeling off the tape.
• Contributes to enhanced productivity with stable wire bonding properties, burr prevention during molding, and low adhesive residue, especially for small package applications such as mini QFN, DFN, and SON.
• Lineup suitability for Cu clip bonding and other high-temperature processes (300-400℃ reflow, etc.).

※Heating is required for some lead frames and epoxy molding compounds.