Resonac’s thermal conductive sheets (TIM material) with electrical conductivity efficiently release heat from IC chips when applied a semiconductor package, and between IC chip and a heat spreader, heatsink or heat pipe.

• Achieves high thermal conductivity in the thickness direction by vertically aligned graphite fillers.
• Increases thermal conductivity by flexibly filling in gaps caused by differences in chip heights or uneven adhesive interface.
• Possible to temporarily fix on heat modules with slight adhesiveness.
• Applicable to next-generation large devices by flexibly fitting warped substrates.

The product’s superior thermal conductivity and cooling effect are expected to contribute to enhancing electronic device reliability and energy efficiency.