Thermal Conductive Sheets (TC)

Semiconductor (Backend)


Resonac’s thermal conductive sheets (TIM material) with electrical conductivity efficiently release heat from IC chips when applied a semiconductor package, and between IC chip and a heat spreader, heatsink or heat pipe.


  • Achieves high thermal conductivity in the thickness direction by vertically aligned graphite fillers.
  • Increases thermal conductivity by flexibly filling in gaps caused by differences in chip heights or uneven adhesive interface.
  • Possible to temporarily fix on heat modules with slight adhesiveness.
  • Applicable to next-generation large devices by flexibly fitting warped substrates.

Sheet Characteristics & Line-Up


Expected field of application

The product’s superior thermal conductivity and cooling effect are expected to contribute to enhancing electronic device reliability and energy efficiency.

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