Resonac’s mold release films are used in film assisted transfer molding processes. It helps to reduce flash burr and is applicable to a wide range of PKGs, including QFN, FC-CSP (Flip Chip-CSP), and BGA.

• Capable of meeting customer needs by combining thickness and surface shapes.
• AS (anti-static) grades can prevent static electricity from damaging devices.
• High burr resistance for exposed molding parts, such as lead frame terminals and exposed die structures.
• Prevents mold contamination caused by epoxy molding compounds.
• Provides stable workability with film wrinkle control and excellent mold release from epoxy molding compounds.