Mold Release Film (RM)

Semiconductor (Backend)


Resonac’s mold release films are used in film assisted transfer molding processes. It helps to reduce flash burr and is applicable to a wide range of PKGs, including QFN, FC-CSP (Flip Chip-CSP), and BGA.


  • Capable of meeting customer needs by combining thickness and surface shapes.
  • AS (anti-static) grades can prevent static electricity from damaging devices.
  • High burr resistance for exposed molding parts, such as lead frame terminals and exposed die structures.
  • Prevents mold contamination caused by epoxy molding compounds.
  • Provides stable workability with film wrinkle control and excellent mold release from epoxy molding compounds.

Film Characteristics & Line-Up

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