Solder Resist for Package Substrates (SR Series)

Material for PWBs


Resonac’s photosensitive solder resist materials protect and insulate high-density wiring used for semiconductor packages.
Resonac boasts a large market share in the field of semiconductor packages using flip-chip packaging.


  • Realizes low warpage due to low CTE and low shrinkage.
  • Contributes to higher density semiconductor packages due to high resolution.
  • Contributes to high reliability (TCT and reflow resistance, etc.) due to high heat resistance.
  • Offers the liquid type SR7300 and film type SR-F series.

Product Characteristics & Line-Up

Available upon request for film thickness

Thermal Cycle Test

TEST Vehicle

CSAM:Constant-depth mode Scanning Acoustic Microscope

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(Monday to Friday)

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