Overview
Resonac’s photosensitive solder resist materials protect and insulate high-density wiring used for semiconductor packages.
Resonac boasts a large market share in the field of semiconductor packages using flip-chip packaging.
Features
- Realizes low warpage due to low CTE and low shrinkage.
- Contributes to higher density semiconductor packages due to high resolution.
- Contributes to high reliability (TCT and reflow resistance, etc.) due to high heat resistance.
- Offers the liquid type SR7300 and film type SR-F series.
Product Characteristics & Line-Up
※Available upon request for film thickness
Thermal Cycle Test
TEST Vehicle
※CSAM:Constant-depth mode Scanning Acoustic Microscope