Die Bonding Paste (DBP)


Resonac’s solvent-free die bonding paste (conductive and non-conductive types) bonds chips to leadframes and organic substrates when manufacturing semiconductor packages.

Resonac offers a wide-ranging lineup with its die bonding paste holding a large global market share.


  • Low elastic modulus and high adhesive strength realizes greater reliability even for MSL1
  • Suitable for package on leadframes and organic substrates
  • Low-cost type using both aluminum and silver filler is also available
  • High thermal conductivity (17W/m-K) type effective for power devices and modules is lined up

Paste Characteristics & Line-Up

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