Film for Package Substrate Circuit Formation (RY Series)

Photosensitive Film (Photec)


Resonac’s photosensitive resist materials designed to form fine-pitch circuits on semiconductor package substrates can form circuits with a film thickness of 10 um or less and a width of 4 um or less.


  • Provides excellent shaped resist profiles, and is capable of forming fine-pitch circuits based on film thickness.
  • Responds to circuit formation by semi-additive processing.
  • Responds to resist patterning using a stepper exposure machine.

Film Characteristics & Line-Up

Projector machine; i-line projector
Developing conditions; 1.0 wt% Na2CO3aq, 30 ℃, Minimum developing time×2

Resist Profile

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