Overview
Resonac’s photosensitive resist materials designed to form fine-pitch circuits on semiconductor package substrates can form circuits with a film thickness of 10 um or less and a width of 4 um or less.
Features
- Provides excellent shaped resist profiles, and is capable of forming fine-pitch circuits based on film thickness.
- Responds to circuit formation by semi-additive processing.
- Responds to resist patterning using a stepper exposure machine.
Film Characteristics & Line-Up
Projector machine; i-line projector
Developing conditions; 1.0 wt% Na2CO3aq, 30 ℃, Minimum developing time×2
Resist Profile
