N-CS Series



Resonac’s Cleaning Sheet for encapsulation molding dies of semiconductor packages.
By placing the sheet between dies and heating it, stains are transferred to the sheet and removed.

How to Use


  • Remove stains with fewer shots than melamine cleaning materials, thereby reducing the cleaning time.
  • Remove stains in cavities, burrs on dies, and gas stains in air vents.
  • Environment-friendly cleaning agent prevents damage and corrosion of molding dies.

Sheet Characteristics & Line-Up

Cleaning Performance

High filling type W Series

With its original form and structure, W series completely fills cavity of mold die without air

  • W series is suitable for molding die with small cavity for small-sized semiconductor, diodes and mini transistor.
  • W seires is designed in a way that cavity is not blocked when the sheet is set on the mold die at any position.
  • With W series, the air inside cavity can completely escape to outside and can remove off stains from the entire cavity.

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9:00 a.m.~5:00 p.m.
(Monday to Friday)

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