Resonac’s Cleaning Sheet for encapsulation molding dies of semiconductor packages.
By placing the sheet between dies and heating it, stains are transferred to the sheet and removed.

• Remove stains with fewer shots than melamine cleaning materials, thereby reducing the cleaning time.
• Remove stains in cavities, burrs on dies, and gas stains in air vents.
• Environment-friendly cleaning agent prevents damage and corrosion of molding dies.

With its original form and structure, W series completely fills cavity of mold die without air

• W series is suitable for molding die with small cavity for small-sized semiconductor, diodes and mini transistor.
• W seires is designed in a way that cavity is not blocked when the sheet is set on the mold die at any position.
• With W series, the air inside cavity can completely escape to outside and can remove off stains from the entire cavity.