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Becoming the First in Japan to Acquire International Certification for a Supply Chain That Adopts Materials Derived from Used Plastics
18 May 2023Resonac Corporation (Tokyo: 4004) (President: Hidehito Takahashi; hereinafter, “the Company”) has acquired ISCC PLUS certification for the three products (hydrogen, ammonia and acrylonitrile) manufactured at its Kawasaki Plant in Kawasaki City, Kanagawa Prefecture. ISCC PLUS is an international certification system for sustainable products. The three products are all manufactured in the Company’s plastic chemical recycling […]
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TOYOTA Adopts Resonac’s Foamed Moldings for Use as Exterior Parts of “LEXUS RZ”
26 April 2023— Resonac’s original technology reduces weight of parts by more than 30% — Foamed Moldings for exterior parts manufactured with original technology developed by Resonac Corporation*1 (President: Hidehito Takahashi) have been adopted by TOYOTA MOTOR CORPORATION for use as exterior parts of “LEXUS RZ,” which is the first battery electric vehicle (BEV) of TOYOTA’s luxurious car […]
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Resonac Gives Presentation on Its Effort to Strengthen Supply Chain at Japan-Malaysia Public Private Industrial Policy Dialogue
06 April 2023On April 3, 2023, Resonac Corporation (Tokyo: 4004) (President: Hidehito Takahashi) took part in “Japan-Malaysia Public Private Industrial Policy Dialogue” held in Kuala Lumpur, Malaysia, and gave a presentation on its effort to strengthen supply chain for semiconductor materials. The first Japan-Malaysia Dialogue was hosted by the Ministry of Economy, Trade and Industry of Japan […]
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Resonac Increases Production Capacity for Adhesive Film for Semiconductor Packaging by 60%
04 April 2023— Resonac Increases Production Capacity for Adhesive Film for Semiconductor Packaging by 60% — Resonac Corporation (TOKYO: 4004) (President: Hidehito Takahashi) will increase its capacity to produce “Dicing Die Bonding Film,” which is a two-in-one adhesive film with the functions for both dicing tape and die bonding film used in semiconductor packaging process (backend process), […]
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DENSO Adopts Resonac’s SiC Epi-wafer for Power Semiconductor for Use in Inverter
31 March 2023— The new inverter will be installed in Toyota’s new BEV “LEXUS RZ” — DENSO CORPORATION has decided to adopt silicon carbide epitaxial wafer for power semiconductor (SiC epi-wafer) manufactured by Resonac Corporation (Tokyo: 4004) (President: Hidehito Takahashi) with the aim of using it as material for driver element of DENSO’s new inverter. This inverter […]
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We exhibit at analytica Vietnam 2023
27 March 2023
Shodex (Resonac Asia Pacific) will join the analytica Vietnam 2023, 7th International Trade Fair for Laboratory Technology, Analysis, Biotechnology and Diagnostics, 19th to 21st April 2023 (Wed to Fri). analytica Vietnam focus on innovative and applied product and system solutions for laboratories in the industrial, research and science sectors. As the industry’s definitive forum, analytica Vietnam gathers […] -
Resonac Starts Full-Scale Operation of Evaluation and Development Base to Innovate Materials for Power Modules
23 March 2023— For Contribution to the Electrification of Vehicles and Others through Co-Creation with External Parties — Resonac Corporation (TOKYO: 4004) (President: Hidehito Takahashi) is set to launch full-scale operation of Power Module Integration Center (“PMiC”), which is located at Oyama Plant in Tochigi Prefecture, to enhance development activity of materials for power semiconductor and its […]
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Resonac Starts Development of New Semiconductor Materials for 6G at the Newly Opened Innovation Base
13 March 2023— With Computational Science and Materials Analysis Professionals Also Stationed at the Same Resonac R&D Center — In January 2023, Resonac Corporation (TOKYO: 4004) (President and CEO: Hidehito Takahashi) is launching a project to develop new semiconductor materials for 6G, the next-generation telecommunication system standard following 5G. Resonac will implement this development project, which starts […]
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RESONAC (Semiconductor Materials Manufacturer in Japan) to Use Virtual Reality Technology for Product Development
09 March 2023— Enables engineers to experience “molecular level visualization,” and makes a significant contribution to accelerating development and discovery of new materials — Resonac Corporation (TOKYO: 4004) (President: Hidehito Takahashi) has successfully applied virtual reality (VR) technology*1 to the development of semiconductor materials. This is the first time that the VR technology has been implemented to […]
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Resonac Develops and Starts to Mass-produce Third Generation High-grade SiC Epitaxial Wafers
01 March 2023— Through supply of top-quality epitaxial wafers, Resonac contributes to practical application of space-saving high-output next-generation power semiconductors — Resonac Corporation (Tokyo: 4004, President: Hidehito Takahashi) has developed a third generation of high-grade silicon carbide (SiC) epitaxial wafer (HGE-3G) for power semiconductors and has started to mass-produce it. HGE-3G has quality superior to that of […]
