Resonac hold free webinar session “Material Solutions for Next Generation Power Module”on 26 th October 2023, twice in same day for EU, US and Asia. Please join us for an enlightening session covering advanced materials in Power Module tech!

Please register from here: https://solution.resonac.com/entry-Oct2023-WebinarForPowerModule?lsrc=Website&cid=REAP

Webinar Topic and presenter:

1. Overall introduction of Resonac's Power Module related materials and technologies
    Rajesh Jose Pendanam
    Head of Marketing

2. High Tg and high thermal conductive Molding Compound for high reliability Power Module and Discrete
   Akihiro Nozaki
   Senior Engineer
   Encupsulation Materials R&D Department

3. Copper Sintering Pastes with High Thermal Conductivity and High Bonding Reliability
   Dr. Hideo Nakako
   Doctor of Engineering
  Senior Researcher, Institute for Advanced Integrated Technology

Date: October 26, 2023
Time: [1] 7:00-8:30am(GMT), 9:00-10:30am(CEST), 15:00-16:30pm(GMT+8)
[2] 16:00-17:30pm(GMT), 9:00-10:30am(PDT)

What you can expect is:

• learn about Resonac’s total material solutions for next generation Power Module development.
• know how you can choose molding compound to achieve your development target.
• learn about the way to improve the reliability by following 2 technologies.
  (1) using high Tg molding compound with optimized property.
  (2) using higher elongation and high thermal conductivity material for die-bonding and large area bonding (between substrate and heatsink).