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Resonac Starts Development of New Semiconductor Materials for 6G at the Newly Opened Innovation Base
13 March 2023— With Computational Science and Materials Analysis Professionals Also Stationed at the Same Resonac R&D Center — In January 2023, Resonac Corporation (TOKYO: 4004) (President and CEO: Hidehito Takahashi) is launching a project to develop new semiconductor materials for 6G, the next-generation telecommunication system standard following 5G. Resonac will implement this development project, which starts […]
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RESONAC (Semiconductor Materials Manufacturer in Japan) to Use Virtual Reality Technology for Product Development
09 March 2023— Enables engineers to experience “molecular level visualization,” and makes a significant contribution to accelerating development and discovery of new materials — Resonac Corporation (TOKYO: 4004) (President: Hidehito Takahashi) has successfully applied virtual reality (VR) technology*1 to the development of semiconductor materials. This is the first time that the VR technology has been implemented to […]
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Resonac Develops and Starts to Mass-produce Third Generation High-grade SiC Epitaxial Wafers
01 March 2023— Through supply of top-quality epitaxial wafers, Resonac contributes to practical application of space-saving high-output next-generation power semiconductors — Resonac Corporation (Tokyo: 4004, President: Hidehito Takahashi) has developed a third generation of high-grade silicon carbide (SiC) epitaxial wafer (HGE-3G) for power semiconductors and has started to mass-produce it. HGE-3G has quality superior to that of […]
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Announcement of Paperless Product Operation Manuals and Certificate of Analysis and Product Package Renewal
31 January 2023
As a part of our environmental contribution, Shodex will shift to provide digital versions of operation manuals and certificate of analysis (CoA) instead of enclosing their printed versions in the products. We will start the action with some products and sequentially shifting into the digital versions, aiming in all Shodex products. This process begins in […] -
Resonac Asia Pacific – Functional Chemicals Products: Vinyl Ester Resin, Emulsion
31 January 2023Resonac successfully developed Epoxy Vinyl Ester resin in the early 1960s based on its independent technology. We are the first company to produce Vinyl Ester resin on a commercial scale and the No.1 Vinyl ester resin supplier in Japan. Resonac Asia Pacific (formerly Showa Highpolymer Singapore Pte Ltd) started to operate the Sales & Marketing […]
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Resonac and Infineon Technologies Strengthen Cooperation in SiC Materials for Power Semiconductors
12 January 2023Resonac Corporation (Resonac) (President: Hidehito Takahashi) has concluded new multiyear contracts with Infineon Technologies AG (Infineon), a German semiconductor manufacturer providing power semiconductors worldwide, to continue supplying SiC materials for power semiconductors to Infineon and cooperatively developing technologies related to SiC materials. Resonac concluded these new contracts in order to complement and expand the preceding […]
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Resonac Aims to be a Leading Functional Chemical Manufacturer by Raising Reformers
04 January 2023-CEO Takahashi Gives New Year Address following the Launch of Resonac- On January 1, 2023, Showa Denko K.K. (SDK) and Showa Denko Materials Co., Ltd. (SDMC, former Hitachi Chemical Company, Ltd.) merged and transformed themselves into two new companies, namely a holding company named “Resonac Holdings Corporation,” and a manufacturing company named “Resonac Corporation” (hereinafter […]
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Vinyl Ester Applications: Past Projects
23 December 2022
Resonac vinyl ester products are loved by customers around the globe and you can view the past projects for your reference. Thermal power plant project in Vietnam ・Year: 2015・Application: FRP Stack・Dimension: D 5,000mm x 200m・Resin: Ripoxy H-630EX, Rigolac 150HRN-EX Sea Water Manifold & Header in India ・Year: 2015・Application: FRP Stack・Dimension: D.5000mm x 200m・Resin: Ripoxy H-630EX, Rigolac […] -
Amalgamation and Name Change
19 December 2022
Please be informed that, pursuant to Section 215A and Section 215D of the Companies Ac 1967 of Singapore (the “Companies Act“), Showa Denko Singapore (Pte) Ltd. (“SSPL“), Showa Denko Materials (Asia-Pacific) Pte. Ltd. (“SDMAP“), and Showa Highpolymer Singapore Pte. Ltd., intend to undertake an amalgamation, whereby SDMAP will continue as the amalgamated company, and the […] -
Analysis of Contaminants Sucrose and Sorbitol in Cranberry Juice According to USP-NF Method (SC1011-7F)
13 December 2022
According to the United States Pharmacopeia and the National Formulary (USP-NF 2022 ISSUE 3* Effective December 1, 2022), analysis of contaminants sucrose and sorbitol in cranberry juice should be carried out with a column with L19 packing material and meets following requirements. The Shodex EP SC1011-7F confirmed the requirements were met. System suitability requirements: Resolution of sucrose and sorbitol: ≥ […]
